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Black ESD Waffle Pack RoHS For Optical Device IC Chip Tray

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Black ESD Waffle Pack RoHS For Optical Device IC Chip Tray

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Brand Name : Hiner-pack

Model Number : HN21084

Certification : ISO 9001 ROHS SGS

Place of Origin : Made In China

MOQ : 1000 pcs

Price : $0.35~$0.85(Prices are determined according to different incoterms and quantities)

Payment Terms : T/T

Supply Ability : The capacity is between 4000PCS~5000PCS/per day

Delivery Time : 5~8 working days

Packaging Details : It depends on the QTY of order and size of product

Material : PC

Color : Black

Property : ESD

Design : Non-standard

Surface Resistance : 1.0x10E4~1.0x10E11Ω

Clean class : General And Ultrasonic Cleaning

Injection Mold : Lead Time 20~25Days, Mold Life Span: 30~450,000 Times

Molding Method : Injection Moulding

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Black ESD Waffle Pack RoHS For Optical Device IC Chip Tray

Get waffle packs built for your process—stackable, ESD-safe, and dimensionally stable.


The use of our products is antistatic raw material, the permanent antistatic performance and short antistatic coating products, even if the product have been unable to use, waste, still has the antistatic performance, we pursue the best quality guarantee, before or after using components will not cause any damage to the customer, the greatest degree of protection you need chips or electronic components.

Technical Parameters:

BrandHiner-packOutline Line Size101.6*101.6*4.5mm
ModelHN21084Cavity Size13.2*0.8*0.32mm
Package TypeN/AMatrix QTY34*5=170PCS
MaterialPCFlatnessMAX 0.1mm
ColorBlackServiceAccept OEM, ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateRoHS/SGS


Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM, ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM, ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM, ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM, ODMTBCCustomizable
Provide professional design and packaging for your products

Application:

Semiconductor Electronics; Component Factories; SMT Surfacing Factories; Optical Industry

Advantages:

1. Lightweight, saving transportation and packaging costs;
2. Size specification, compatible with any 2 ", 3 ", or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensures that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, and cost saving;

7. Edge chamfer design effectively prevents stacking errors and corrects the direction of placement.

FAQ:

Q1: Are You a Manufacturer or a Trade Company?

A: We are a 100% Manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.

Q2: What is the material of your product?

A:ABS, PC, PPE, MPPO, PEI, HIPS...etc.

Q3: Can you help with the design?

A: Yes, we can accept your customization and do the packaging for you according to your requirements.

Q4: How can I get the quotation for the custom products?

A: Let us know the size of your IC or component thickness, and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

A: Yes, the free sample in stock can be sent, but the shipping fee should be paid by you.

Q6: Could you put my logo in our product?

A: Yes, we can put your logo on our product. Show us your logo first, please.

Q7: When can we get the samples?

A: We can send them right now if you are interested in something we have in stock, and the project depends on the specific time.


Product Tags:

Injection Moulding Waffle Pack Tray

      

Optical Device Waffle Pack Tray

      

0.2mm Flatness IC Chip Tray

      
Wholesale Black ESD Waffle Pack RoHS For Optical Device IC Chip Tray from china suppliers

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