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Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

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Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Tray Shape : Rectangular

Color : Black

Quality Assurance : Delivery Guarantee, Reliable Quality

Cavity Size : 6.49x3.86x0.67 mm

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Outline Line Size : 50.8×50.8×3.94 mm

Incoterms : EXW, FOB, CIF, DDU, DDP

Mold Type : Injection

MOQ : 1000

Payment Terms : T/T

Capacity : 5x7=35 PCS

Brand Name : Hiner-pack

Delivery Time : 10 workdays

Reusable : Yes

Ic Type : BGA,QFP,QFN,LGA,PGA

Warpage : Warpage MAX 0.2mm

Model Number : HN24174

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Clean Class : General And Ultrasonic Cleaning

Supply Ability : 2000PCS/Day

Packing Level : Transport package

Packaging Details : CARTON, PALLET

Certification : ROHS, ISO

Place of Origin : China

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Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Deliver stable anti-static protection for IC chips. Withstand up to 125℃ high temperature. Adopt optimized cross-slot structure to lock components tightly. Keep chips safe from dust and contamination. Need reliable semiconductor chip carrying solutions?


Fit semiconductor encapsulation, chip testing, die sorting and wafer processing. Adapt to automated production lines and precision handling workflows. Work smoothly in cleanroom and workshop environments.


Support chip turnover, storage, logistics and vacuum packaging. Offer flexible cavity size, layout and material customization. Create exclusive cross-slot designs for various IC models to meet specific needs.

Key Features/ Benefits
  • Deliver effective ESD anti-static performance
  • Stable high-temperature resistance up to 125℃
  • Suitable for Delicate Fine Pitch ICs
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24174
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 6.49x3.86x0.67 mm
Matrix QTY 5x7=35 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Apply to semiconductor encapsulation, IC performance testing, die sorting and wafer fabrication. Adapt to high-precision electronic manufacturing and cleanroom operations.


Support chip internal turnover, long-term storage, logistics and vacuum packaging. Meet diversified integrated circuit processing and electronic assembly needs.

Customized Services
Accept personalized cross-slot customization. Offer flexible cavity size, layout and material upgrades. Create exclusive designs for diverse IC specifications. Provide one-stop tailored solutions for semiconductor packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

anti-static semiconductor IC chip trays

      

high temperature waffle pack trays

      

cross-slot waffle chip trays

      
Wholesale Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips from china suppliers

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