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Clean Production JEDEC IC Trays for Wafer Protection

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Clean Production JEDEC IC Trays for Wafer Protection

Color : Black

Supply Ability : 2000PCS/Day

Model Number : HN25012

Mold Type : Injection

Capacity : 11X26=286 PCS

Quality Assurance : Delivery Guarantee, Reliable Quality

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Incoterms : EXW, FOB, CIF, DDU, DDP

Clean Class : General And Ultrasonic Cleaning

Reusable : Yes

Flatness : Less than 0.74mm

Packaging Details : CARTON, PALLET

Brand Name : Hiner-pack

Certification : ROHS, ISO

Tray Shape : Rectangular

Packing Level : Transport package

MOQ : 500

Payment Terms : T/T

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Place of Origin : China

Cavity Size : 4×4×0.75 mm

Delivery Time : 10 workdays

Ic Type : BGA,QFP,QFN,LGA,PGA

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Clean Production JEDEC IC Trays for Wafer Protection
Shield delicate semiconductor wafers from dust and damage during production and handling. Maintain clean production environment effectively. Built with sturdy structure to meet JEDEC standards for long-term industrial use. Looking for reliable tray solutions for wafer protection?

Fit automated assembly lines and packaging plants perfectly. Perform steadily in wafer transfer and packaging procedures. Adapt to diverse semiconductor manufacturing processes smoothly.

Enable safe wafer storage and factory logistics. Support custom designs to meet specific production demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.
Key Features/ Benefits
  • Strong durable structure
  • Effective dust prevention
  • Safeguard wafer packaging processes
  • Clean production support
  • Flexible customization
Specifications
Brand Hiner-pack
Model HN25012
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 4×4×0.75 mm
Matrix QTY 11X26=286 PCS
Warpage MAX 0.74mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Serve semiconductor front-end processing, wafer probing, final assembly, and device testing operations. Adapt to cleanroom Class 100/1000 environments, automated material handling systems, and high-temperature manufacturing processes.

Also utilized in inter-factory wafer transfer, third-party testing services, and finished device inventory management. Cater to integrated device manufacturers, foundries, and outsourced semiconductor assembly and test facilities.
Customized Services
Offer end-to-end customization for JEDEC IC trays. Collaborate with engineering teams to define cavity pitch, pocket depth, and material properties for specific wafer sizes and thicknesses. Develop anti-static or high-temperature resistant variants, and validate prototypes through in-house testing. Deliver fully tailored tray solutions that optimize production flow and minimize contamination risks for advanced semiconductor manufacturing.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

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